Description
Zapit Block Out Material was developed to fill in all voids and undercuts, or to correct anomalies in models and dies.
- Simplifies die repairs and preparation
- Improves accuracy of multiple-unit bridges
- Indicates existence of undercut areas in preparations
- Eliminates contamination of soldering surfaces
- Zapit base shrinks less than wax
- Zapit burns-out cleaner than resins
